Provide 1 page slide on this chip era

This training session provides a comprehensive overview of the technological evolution in chip packaging, spanning from DIP and Metal Can Packages of the 1970s to today's advanced solutions like 3D IC stacking and hybrid bonding. Participants will gain technical insights into pivotal innovations, including BGA, Flip-Chip, TSV, and Fan-Out WLP, while examining how these advancements have shaped efficiency, size reduction, and performance in semiconductor design. Designed for technical...